Join CEVA at Mobile World Congress 2013, where we will be showcasing the industry’s leading technology portfolio for communications, audio, voice, computer vision, and imaging applications. As the world’s leading DSP architecture deployed in handsets today and with more than 4 billion CEVA-powered devices shipped to date, rest assured we know what it takes to ensure your next-generation smartphone and mobile computing SoCs are a cut above your competition!
At Booth 7i70 in Hall 7, CEVA technology experts will demonstrate a range of fully programmable DSP cores and platforms targeting LTE-Advanced, software defined Wi-Fi 802.11ac, natural user interface (NUI) including gesture recognition, voice activation and face recognition, image enhancement and computer vision, audio post-processing and noise reduction, and software-based GPS applications.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 46% of handsets shipped worldwide are powered by a CEVA DSP core.
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